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Copper plating describes the process of depositing a layer of copper onto the item to be plated using an electric current. To maintain quality and consistency of plating, the process must be tightly controlled. The acid copper plating bath method is one of the most common approaches used in copper plating. The main components include copper sulphate and sulphuric acid, in addition to a number of additives. The organic additives influence the quality of the copper deposition and typically include an accelerator (such as bis-(3-sodiumsulphopropyl) disulphide), a suppressor (a polyalkylglycol), and a leveller (either a large-molecular-weight polymer or small molecule containing nitrogen or sulphur).