Study of the resistance to oxidation in copper alloys by Thermal Gravimetric Analysis (TGA) (CAT#: STEM-ACT-0033-WXH)

Introduction

Oxidation of pure copper at elevated temperatures leads to formation of copper oxides with various appearance. It was found that the temperatures over 500 °C provide even, black surface, which is result of formation of copper (I) oxide Cu2O.
Copper alloys are metal alloys that have copper as their principal component. They have high resistance against corrosion.

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Principle Applications Procedure Materials Notes Related Products

Principle

Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis in which the mass of a sample is measured over time as the temperature changes. This measurement provides information about physical phenomena, such as phase transitions, absorption, adsorption and desorption; as well as chemical phenomena including chemisorptions, thermal decomposition, and solid-gas reactions (e.g., oxidation or reduction).

Applications

• Thermal characterization of polymers.
• Determination of the composition of alloys and mixtures.
• Determining the purity and thermal stability of both primary and secondary standards.

Procedure

TGA analysis is performed by gradually raising the temperature of a sample in a furnace as weight is measured on an analytical balance that remains outside the furnace. Thermogravimetric analysis instrument measures the changes in a sample's weight in a particular temperature by enclosing the sample in an oven.

Materials

Thermogravimetric analyzer

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