Copper Nanoparticle Dispersion, 25 nm, CU-M-01-NPD (CAT#: STEM-NN-1515-LC)

CAS #: 7440-50-8
Linear Formula: Cu
MDL Number: MFCD00010965
EC No.: 231-159-6
Molecular Weight: 63.55
Appearance: Liquid dispersion
Melting Point: Varies by solvent
Boiling Point: Varies by solvent
Density: Varies by solvent
Bulk Density: 0.15 -0.35 g/cm3
True Density: 8.96 g/cm3
Size Range: 2-60 nm
Average Particle Size: 25 nm
Specific Surface Area: 30-50 m2/g
Morphology: Spherical
Solubility in H2O: N/A
Poisson's Ratio: 0.34
Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1
Vickers Hardness: 369 MPa
Young's Modulus: 110–128 GPa
Signal Word: N/A
Hazard Statements: N/A
Hazard Codes: N/A
Risk Codes: N/A
Safety Statements: N/A
RTECS Number: GL5325000
Transport Information: N/A
WGK Germany: 3
MSDS / SDS: Request MSDS / SDS
Linear Formula: Cu
MDL Number: MFCD00010965
EC No.: 231-159-6
Pubchem CID: 24847820
IUPAC Name: N/A
SMILES: [Cu]
InchI Identifier: InChI=1S/Cu
InchI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N