Determination of Melting Point of Sn-Ag-Cu Solder Alloy on Cu Substrate by Instantaneous Method (CAT#: STEM-PPA-0119-YJL)

Introduction

There have been several regulations to ban Pb from electronic products all over the world. The European Union’s RoHS directive is the initial driving force for the elimination of Pb because Pb contained in conventional solder materials has harmful influence on the environment and human health. As a result, lead-free solders with microstructure stability and mechanical properties comparable with eutectic Pb–Sn solder stimulate immense interests in microelectronic application. Nowadays several lead-free solders including Sn-Ag, Sn-Cu, Sn-Zn, Sn-Ag-Bi and Sn-Ag-Cu systems have been developed. Among them, the near-ternary eutectic Sn-Ag-Cu system solders have been regarded as primary candidates because of their good mechanical and acceptable wetting properties as well as suitable melting points.