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FareBead Conductive Microsphere Spacer, NI 0325, 3.65±0.05 μm (CAT#: STEM-C-4111-ZJF)

Highlights

Nickel and Gold Shell: FareBeadTM conductive microspheres are available with either a nickel or gold shell for enhanced conductivity.
Uniform Particle Size: Features uniform particle size for consistent performance in microcircuit connections.
High Conductivity: Offers high conductivity, ensuring efficient electrical connections.

Cat Number: STEM-C-4111-ZJF

Application: For precise spacing, structural support, and conductivity in LCD panels, PDLCs, and microcircuit assembly.

Model: NI 0325

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Description

FareBead conductive microspheres, available with nickel or gold shells, are widely employed in microcircuit connections. These microspheres feature uniform particle size, high conductivity, optimal elasticity, and strong adhesion between the metal shell and polymer core.
FareBead conductive microspheres are specifically designed for connections between closely spaced electrodes, such as vertical conduction between COG and LCD glass plates. They can also be dispersed in binders to prepare anisotropic conductive film (ACF) or anisotropic conductive gel (ACP), essential for LCD display assembly.
These conductive microspheres are backed by several national invention patents, demonstrating their innovative and reliable performance in advanced electronic applications.

Specification

Average particle diameter: 3.65±0.05 μm
10% Modulus of Elasticity, kgf/mm²: 200-700 (Test Method: Shimadzu MCT210)
Specific Gravity, g/cm³: 1.3-3.0 (Test Method: Multi-Volume Density Test)
Coefficient of Thermal Expansion, 10⁻⁵ °C⁻¹: ~5.4 (core), 1.3-1.4 (metal)
Volume Resistivity, 10 kg/10 mm diameter cell, Ω·cm: < 1×10⁻² (Test Method: JIS K6911)

Features

Nickel and Gold Shell: FareBeadTM conductive microspheres are available with either a nickel or gold shell for enhanced conductivity.
Uniform Particle Size: Features uniform particle size for consistent performance in microcircuit connections.
High Conductivity: Offers high conductivity, ensuring efficient electrical connections.
Suitable Elasticity and Strong Adhesion: Designed with suitable elasticity and strong adhesion between the metal shell and polymer core.
Microspacing Electrode Connectivity: Ideal for vertical conduction between COG and LCD glass plates.
Used in ACF and ACP: Can be dispersed in a binder to prepare anisotropic conductive films (ACF) or gels (ACP) for LCD display assembly.
Patent Protected: FareBeadTM conductive microspheres are protected by several national invention patents.

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